real time x ray inspection equipment
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Food X-Ray Detection Equipment For Checking Bagged Food With Auto Rejector
Food Impurity Real Time Inline Detection UNX4015N For Food-Packing Quality Inspection Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Provide High precision automatic foreign
Real Time NDT UNC160 X Ray Equipment For Automotive Parts Quality Checking
Real Time NDT UNC160 X Ray Equipment For Automotive Parts Quality Checking Applications of NDT X-ray Machine UNC160: Cast parts and Pressure Vessels Steel pipe, Cylinder, and Wood Epoxy Resin Defect Detection Wheel, Tires, and Metal parts FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How about the after-sales service? 1
Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine
Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
AX7900 Automatic X-ray mapping inspection for IC electronics components inner quality and counterfeit checking
AX7900 Automatic X-ray mapping inspection for IC electronics components inner quality and counterfeit checking Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips
HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)1200(D)1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)1350(D)1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m
Real Time UNC160 NDT X Ray Machine For Aluminum Casting Quality Checking
Real Time NDT UNC160 X Ray machine For Steering Wheel aluminum casting Quality Checking System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm Resolution 3
AX7900 Real Time Auto Offline X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void
5m Microfocus X-ray with FPD 55 tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD)