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Sealed Tube Unicomp X Ray Interactive Touch 90kV Benchtop For Indwelling Needle
Unicomp Factory directly supply of 90kV X-ray machineto find medical indwelling needle inside crack defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3. Accurate Control,
Sealed Tube Unicomp X Ray LCD Display AX8200MAX 1.0kW Inspect Venous Indwelling Needle
Discovering how the Unicomp AX8200Max X-ray machine to inspect medical venous indwelling needle qualtiy issue Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3. Accurate
Microfocus 2.5D Unicomp X Ray AX8200 Max 5um 6 Axis Manipulator For Electronics
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3.
Close Tube Unicomp X Ray AX8200 Max 5μM For Automotive Electronics
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3. Accurate Control,
Real Time Imaging NDT X Ray Equipment For Small Casting Parts Flaws Detection
Real Time Imaging NDT X Ray Equipment For Small Casting Parts Flaws Detection Factory directly supply of Real-time Imaging NDT X-ray Equipment for Small Casting parts flaws detection Technical Data of NDT X-Ray machine Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum
Unicomp AX8200MAX 2.5D X Ray Machine Auto Measurement For PCBA BGA QFN
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3. Accurate
Real Time Unicomp X Ray Machine AX8200MAX 5 Micron Closed Tube For SMT EMS BGA Void Check
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD
Unicomp AX8200max X Ray Inspection Machine For Wire Harness Defects Inspection
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC
Industrial X Ray Imaging System 80kV / 90kV Source With Submicron Focal Spot Size
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
