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High Magnifications PCB X-Ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
IC Curvature Measurement Unicomp AX9100MAX X-Ray Machine with 84μm Pixel Size and 60° Tilting Angle
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB X-Ray Machine Unicomp AX9100MAX High Resolution Micron Focus Spot Size for BGA Voids and Solder Paste Inspection
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption
130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Upgraded Model AX9100MAX With Dual Computers For PCB&BGA Inspection
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4
High Specifications Electronic Boards 2D & 2.5D X-Ray Machine Unicomp AX9100MAX With 360 Degrees Rotation Table For BGA And PCB Inspection
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight
3.5kW LED Bar Inline X Ray Machine ADR Detection System For Inside Quality Inspection
LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
LED Strip Soldering Electronics X Ray System Void Flaw Detection CNC Control Mode
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
Auto Parts Real Time X Ray Equipment , Ndt X Ray Equipment 100mm Penetration
Aluminum 100mm Penetration Auto Parts Compact X-ray Cabinet Solutions Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. System Introductions X-ray real-time imaging system has several characteristics such as:
Inline SMT SMD X ray Component Chip counter X-ray for warehouse inventory
Inline SMT SMD X ray Component Chip counter X-ray for warehouse inventory This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the
