x ray machine for manufacturing
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Welding Joint Test X Ray Flaw Detector With Anodic Grounding , Wooden Case Package
Welding Joint Test Machine X Ray Flaw Detector Unicomp Installed in Kenya Paneramic radiation NDT X Ray Equipment with ripple ceramic x-ray tube plays important parts in carrying on nondestructive examination for nonmetallic, light metal, casting, various alloys and pressure vessels etc, mainly detecting weld defects ,such as crack, blowhole, entrapped slag, incomplete fusion ,blowhole,bubble etc ,also using for shipbuilding ,airplane and national defense etc industry field
100kV PCBA X Ray Inspection System Unicomp Electronics For BGA Void / Soldering
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 m Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4/2 (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
AC 110~220V Bga Inspection Equipment Hi Resolution FPD Detector For SMT Industrial
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
BGA Inspection X Ray Equipment 22" LCD With CNC Programmable Detection Function
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
IC High Image Resolution Unicomp Weld X Ray Inspection Machine Microfocus
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: 1000X magnification, high-definition real-time image. 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
SMT BGA Inspection X Ray Chip Counter 440mm Tunnel CE
Features Automatic inspection, no need on programs switch for different components Fast speed and high accurate chip counting, reducing labor costs No chip damage or lost with non-destructive counting Compatible with 7~17 tape & reels Automatic link with ERP & MES System, and storage system Shielded cabinet protection to guarantee Safety leakage of X-ray Fast counting Speed:12~13s/Reel Inspection Accuracy: 99.9% Min. Package: 01005 One-button operation,
Inventory Counting X Ray Chip Counter Flip Chip For Electronics Components
High precision SMD X-Ray chip counter Unicomp CX7000L for electronics components inventory counting Features Automatic inspection, no need on programs switch for different components Fast speed and high accurate chip counting, reducing labor costs No chip damage or lost with non-destructive counting Compatible with 7~17 tape & reels Automatic link with ERP & MES System, and storage system Shielded cabinet protection to guarantee Safety leakage of X-ray Fast
SMT PCBA Electronics X Ray Chip Counter Unicomp CX7000L 440mm Tunnel
Factory directly supply of SMD Xray Chip counter Unicomp CX7000L for SMT and PCBA electronics compamy Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (10%) 50Hz Working Mode Off-line System Computer Operating System
X Ray SMD Chip Counter CX7000L 1.1kW With ERP MES Warehouse Database Integration
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
