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Multipurpose Unicomp X Ray System , NDT Inspection Machine 160KV UNI160-Y2-D9
Unicomp X Ray Online Wheel Hub Industry NDT Detection Machine 160KV UNI160-Y2-D9 Feature: Covers a wide range of parts inspection. Multipurpose, high resolution. High availability system. Excellent quality of detection image. Safety operation of equipment. Flexibility tooling and fixture. Easy to operate, user-friendly software design. customized to provide solutions. After-sales service of the entire network. Low cost of testing services. System
Portable Metal Industry NDT Unicomp X Ray Detector Hull Pipeline Vessel
Portable Metal Industry NDT Unicomp X ray Detector Hull Pipeline Vessel Features: Compact design,anodic grounding,forced air cooling; Light-weight,protable and convenient; Work and rest with 1:1 time ratio; Nice modeing,reasonable structure; Delayed exposure to keep safety. Applications: Suitable for national defense,shipbuilding,petroleum,chemical,machinery,aerospace,and construction industries inspect for material such as hull,pipeline,high pressure vessel,boiler
90kv Real-time High Precision X Ray Machine Unicomp AX7900 For PCBA Quality Control
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
High Resolution Flip Chip Unicomp Electronics X Ray Machine AX8200
Electronics X-Ray Unicomp AX8200 Machine With Direct Factory PriceThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework operation.
IC High Image Resolution Unicomp Weld X Ray Inspection Machine Microfocus
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: 1000X magnification, high-definition real-time image. 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
Unicomp AX8200max FPD Detector X Ray Machine For EMS SMT PCBA QFP
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24 FHD Interactive Touch LCD Display 3
4KW Unicomp X Ray Detection Machine 18650 Cylindrical Battery
Inline Automatic X Ray Inspection Machine for 18650 Battery LX-1Y60-110 Aftersales service: A professional service team Country-wide network 24/7 hotline Onsite installation, debugging and training services Scheduled call & visits Life-long free software upgrading Prodcution Capacity Wuxi Factory: 6000M2 Shenzhen Factory: 9000M2 Chongqing Factory:8500M2 Current Capacity: 300 Sets /Month Expansion Capacity: 1000 Sets/Month Features: 1, Fully automated
Unicomp Microfocus X Ray Inspection System 130kV 3um For FPD Image
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
BGA QFN Unicomp X Ray Inspection System 130KV With 6 Axis Movement
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
