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|Name:||BGA X Ray Inspection Machine||Application:||SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor|
|Tube Voltage:||100KV||Max.Detection Dimension:||350x450mm|
|Voltage/Current:||90kv/200μA||Tilt Detection Angle:||60°|
bga inspection equipment,
bga x ray machine
Electronic and electrical components BGA X Ray Inspection Machine
|Motion Control System||Motion Control Mode||Mouse&Joystick&Keyboard|
|Tilt Detection Angle||60°|
|X-Ray System||Tube Type||Closed|
|Focal Spot Size||5μm|
|Physical & Image Processing Parameters||Length x Width x Height||1250 x 1300 x 1900 mm|
|System Magnification||500 x|
X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Contact Person: Unicomp-sales