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High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type

Basic Properties
Place of Origin: China
Brand Name: UNICOMP
Certification: CE, FDA
Model Number: AX8500
Trading Properties
Minimum Order Quantity: 1Set
Price: can negotiate
Payment Terms: T/T, L/C
Supply Ability: 300 sets per month
Product Summary
Electronic and electrical components BGA X Ray Inspection Machine Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA ...

Product Details

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bga inspection equipment

,

bga x ray machine

Name: BGA X Ray Inspection Machine
Application: SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Tube Voltage: 100KV
Max.Detection Dimension: 350x450mm
Voltage/Current: 90kv/200μA
Tilt Detection Angle: 60°
Product Description

Electronic and electrical components BGA X Ray Inspection Machine

 

 

Item Definition Specs
Motion Control System Motion Control Mode Mouse&Joystick&Keyboard
Max.Load Dimension 500x500mm
Max.Detection Dimension 350x450mm
Tilt Detection Angle 60°
X-Ray System Tube Type Closed
Voltage/Current 100kv/200μA
Focal Spot Size 5μm
FPD Detector FPD
Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm
Weight 1500 kg
Power 2kW
System Magnification 500 x
  Leakage Dose <1μSv/h


 


X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.

 

 

 

X-ray Inspecting Features:

 

(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.

 

(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.

 

(3) The test preparation time is greatly reduced.

 

(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.

 

(5) Double layers board and multi-layer boards only one check (with layered function).

 

(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.

 

Inspection Images:
High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type 0

 

 

Overall Rating
5.0
★★★★★
★★★★★
Based on 50 reviews recently
5 star
100%
4 star
0
3 star
0
2 star
0
1 star
0
All Reviews
  • M
    Marek
    Hungary Feb 10.2026
    ★★★★★
    ★★★★★
    The machine is excellent, the service is satisfactory, and the technology is highly professional.
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
  • P
    Peter
    France Feb 20.2025
    ★★★★★
    ★★★★★
    good product
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