Electronics X Ray Machine
AC 110/220V Power Supply X-Ray Inspection Equipment With Sealed Tube Design
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features: Large Size Inspection Table. Laser ...
High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...
AI Super‑Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector
AI Super-Resolution Reconstruction UNICOMP AX9100MAX CE FDA Certified SMT Solder Void Defect Detector Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision ...
5μm Minimum PCB PTH Plated Through Hole AX8300MAX Unicomp Inner Wall Defect QC Equipment
AX8300MAX X-ray Inspection System Advanced 5μm minimum PCB PTH plated through hole inspection equipment with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. ...
Detector Max 60° Tilt CNC Automatic Inspection AX8300MAX Unicomp PTH Defect Inspection Tester
Detector Max 60° Tilt CNC Automatic Inspection AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. Applications This ...
Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconduc...
Flat‑Panel Detector Worktable PCB Assembly BGA AX8300MAX Unicomp Cold Solder Joint Scanner
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for ...
5μm Minimum Resolution CNC Electronic BGA Package AX8300MAX Unicomp Missing Solder Ball QC Detector
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection ...
CNC Auto Scanning Function 5μm Min Resolution Fingerprint Access Control SMT BGA Component AX8300MAX Unicomp
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features CNC auto scanning function with 5μm minimum resolution for fingerprint access control, SMT, and BGA component inspection. Applications ...
