bga inspection equipment
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Unicomp CX3000 Desktop Electronics X Ray Machine With Reel To Reel JEDEC Tray And Tube
Electronics components couterfeit inspection with Unicomp desktop X-ray CX3000 with reel to reel, JEDEC tray and Tube Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection
Industrial X Ray Imaging System 80kV / 90kV Source With Submicron Focal Spot Size
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
Desktop BGA Voids 90kV 8W Electronics X Ray Machine 22" LCD
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 m Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22" LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm205mm Max. Inspection Area 190mm165mm Max.
Electronics X-ray Inspection Machine AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder High Precision
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
130kV Microfocus AX9100 Unicomp X Ray For Automotive Connector
130kV Microfocus X-ray AX9100 for automotive connector inner connection quality defect wire broken inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor,
IC Semiconductor Unicomp X Ray High Magnification Microfocus AX9100 130KV
Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification,
CX3000 Benchtop X Ray Machine Small Unit For Checking LED CSP Phone
CX3000 Benchtop Electronics X-ray Machine Small Unit for Checking LED CSP Phone FEATURES: 1. 5m 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 10001124; 3. Equipped with 360 rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. OUR SERVICE 1. Your inquiry will be replied
