bga x ray inspection system
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Micro Focus X Ray Semiconductor Inspection Equipment Inline 2D
Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition Technical Parameters and SpecificationsSystem SummaryFootprint2595(W)1392(D)1992(H)mmMachine Weight1900 kg (X-Ray) / 700kg (Conveyor)Power SupplyAC 110~220V, 50/60HzPlywood Packing Size180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor)Packing Weight2000kg (X-Ray) / 800kg (Conveyor)Power Consumption3.5 kWX-Ray TubeTube TypeSealedMa
AX7900 Real Time Digital X Ray Machine For Switch Inner Defects Inspection
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 Real Time Auto Offline X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
R2R-Enabled CX3000 Desktop X-ray System for Accurate PCBA Inspection and SMT Applications
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5m 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 10001124; 3. Equipped with 360 rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery
CNC Programming X Ray Detector Automatic For PCBA BGA CSP QFN
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Test Images: Features: 1000X magnification, high-definition real-time image. 90-130KV 5m X-Ray tube.
CSP LED Benchtop X Ray Machine 0.8KW Unicomp AX7900 DXI System
Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
