bga x ray inspection system
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Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD)
Semiconductor High Resolution Welding X Ray Machine 90KV 5um
90kV 5um High Resolution And Long Lifespan X-Ray Machine For SMD PCBA Soldering Qualtiy Inspection The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and
SMT BGA Electronics X Ray Machine FPD 1000X Magnification Unicomp AX8500
Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 Real Time Auto Offline X Ray Machine For Electronics Inner Defect Inspection
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
R2R-Enabled CX3000 Desktop X-ray System for Accurate PCBA Inspection and SMT Applications
Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5m 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 10001124; 3. Equipped with 360 rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging
CNC Programming X Ray Detector Automatic For PCBA BGA CSP QFN
Automatic Measurement With CNC Programming X-Ray Equipment For PCBA BGA CSP QFN Reflow Soldering Quality Inspection Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Test Images: Features: 1000X magnification, high-definition real-time image. 90-130KV 5m X-Ray tube.
CSP LED Benchtop X Ray Machine 0.8KW Unicomp AX7900 DXI System
Venous Indwelling needle inside assembly quality inspection by Unicomp AX7900 X-ray machine Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
