bga x ray inspection system
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BGA 90kV Electronics X Ray Machine For Solar Photovoltaic Soldering
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
High Quality 90kV X Ray Inspection Machine Unicomp AX7900 For BGA Quality Accuracy Testing
High quality 90kV X ray inspection machine Unicomp AX7900 for BGA quality accuracy testing Description of IC X Ray machine AX7900: It finds widespread application in industries like BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductors, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among various others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement
90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)155(D)200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m Imaging System Detector
0.8kW BGA Void Measurement X Ray Machine For Mobile Phone PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)1180(D)1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)128(D)196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5mImaging SystemDetectorFlat Panel Detector (option 4 i.i. Detector)Pixel Size85mEffective Detection Area130*130mmFrame Rates20fpsPi
CSP AX8200 Electronics X Ray Machine 100KV For Solar Cell Soldering
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Integrated Generator SMT / EMS X Ray Machine With High Resolution Imaging Chain
Metal X Ray Machine with integrated generator & a high-resolution imaging chain The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection
Unicomp AX8200MAX 5um microfocus X-Ray machine for EMS Automotive PCBA BGA QFN CSP soldering defects Inspection Specification Of Unicomp AX8200MAX System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)155(D)200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
CNC Programmable 1.0 kW X Ray Machine For SMT BGA QFP PoP Package
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely 02 project and 863 project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
0.8kW 5um FDA Electronics X Ray Machine For SMT BGA Soldering
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
