bga x ray inspection system
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High Magnification Unicomp X Ray 130KV For Aviation Aerospace
Aviation, Aerospace and Automotive Connector inside quality checking with High Magnification X-ray machine from Unicomp Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
Electronics Industry Unicomp X Ray 130kV AX9100 For SMT PCBA LED Soldering
Unicomp factory supply 130kV microfocus AX9100 X-ray for SMT PCBA LED soldering void automatic measurement Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high
1.6kW Electronics X Ray Machine 130kV AX9100 For SMT LED QFN Soldering Void
130kV Microfocus AX9100 X Ray For SMT LED QFN soldering void automatic mapping and measurement Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery
Close tube 2.5D X-ray Machine AX9100 for LED soldering quality control with high resolutin images
Close tube 2.5D X-ray Machine AX9100 for LED soldering quality control with high resolutin images Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging
CNC 160KV NDT X Ray Equipment BGA For Iron Casting Parts
Wheel Hub / Rim Casting Parts Quality Control By Unicomp High Penertration UNC160 X-Ray System Features: Strong penetration,high reliable,low breakdown, long life; High definition,resolution FPD; Multi-functional workstation,360rotation and shift; High automation,fast detection speed; User friendly software design for interfacing and to facilitate,customize software function development requirement. System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment
Highly Flexible X Ray Examination Equipment For Electronics And Semiconductor
Highly flexible and cost effective electronics and semiconductor X Ray Machine X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X-ray Inspecting Features: (1) Coverage of process defects up to 97%.
Desk-top Multi-function microfocus CX3000 X-ray Inspection System for electronic components fake inspection
Desk-top Multi-function microfocus CX3000 X-ray Inspection System for electronic components fake inspection Specification Of X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
