industrial inspection systems
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SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
BGA Inspection X Ray Equipment 22" LCD With CNC Programmable Detection Function
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
CNC Programmable Detection Electronics X Ray Machine Golf Ball Inner Quality Inspection
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
PCB BGA Inspection Electronics X Ray Machine Golf Ball Inside Quality Checking
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable
High Resolution NDT X-ray system for Automotive casting Parts Quality Inspection
High Resolution NDT X-ray system for Automotive casting Parts Quality Inspection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm Resolution 3.0LP/mm
Multi-manipulator 160KV Radiography DR X-ray NDT inspection system for gas cylinder crack porosity checking
Multi-manipulator 160KV Radiography DR X-ray NDT inspection system for gas cylinder crack porosity checking System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm
CCD Camera BGA QFN DFN Electronics X Ray Machine
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 m Motion range (Up and Down) 150mm Magnification 600X Detector FPD Active Area: 130mm*130mm Resolution 58 LP/cm Camera 2 Mega Pixel CCD Motion range (Up and Down) 290mm
320KV High Definition Real Time X Ray Equipment For Brake Vehicle Parts
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
