industrial inspection systems
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AX9100 130kV Microfocus Electronics X Ray Machine With FPD Oblique View 360 Rotation Table
AX9100 130kV microfocus X-ray with FPD oblique view and 360rotation table for electronic components check Features of Unicomp AX9100: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications of Unicomp AX9100: SMT, BGA, CSP, Flip
AX9100 Unicomp X Ray Machine 130kV Close Tube For PCBA BGA QFN Soldering Void Check
130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
High Precision UNICOMP X Ray CT Machine AX9500 For Accurate PCB / BGA Inspection
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
Real Time X Ray Imaging System For Dynamic Precise Casting Part Inspection
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
High Automation Bga X Ray Machine For Dry Joint Detection And Analysis
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm
Unicomp real time digital NDT X-ray Inspection System UNC160S for Pipe Inner welding flaws detection
Unicomp real time digital NDT X-ray Inspection System UNC160S for Pipe Inner welding flaws detection Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE approval. 2. Unicomp x-ray systems
22" LCD Monitor SMT EMS Soldering Defects Electronic Inspection Equipment High Resolution
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55 and rotation 360operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
HD Camera Unicomp X Ray 130kV For Inspecting PCBA Boards
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions
