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Quality 3um Closed Tube 1.6kW X Ray Machine For SMT BGA CSP factory

3um Closed Tube 1.6kW X Ray Machine For SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor,

Quality 3µM Microfocus Tube X Ray Machine AX9100 for CSP EMS BGA factory

3µM Microfocus Tube X Ray Machine AX9100 for CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Quality 130kV 3um Microfocus X Ray FPD Intensifier For Aluminum PCBA Soldering factory

130kV 3um Microfocus X Ray FPD Intensifier For Aluminum PCBA Soldering

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.

Quality Analysing Inline SPC Electronics X Ray Machine LX2000 FPC For BGA QFN Soldering factory

Analysing Inline SPC Electronics X Ray Machine LX2000 FPC For BGA QFN Soldering

Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)1392(D)1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Quality Unicomp LX2000 CSP BGA X Ray Machine EMS Inline AXI Inspect Ceremic Air Hole factory

Unicomp LX2000 CSP BGA X Ray Machine EMS Inline AXI Inspect Ceremic Air Hole

Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)1392(D)1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.

Quality IC Semiconductor Unicomp X Ray High Magnification Microfocus AX9100 130KV factory

IC Semiconductor Unicomp X Ray High Magnification Microfocus AX9100 130KV

Directly factory supply of microfocus X Ray System AX9100 with high magnification for IC Semiconductor Inspection Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification,

Quality Flaw Inspection Unicomp X Ray Aluminum Casting 160KV Fully Shield Cabinet factory

Flaw Inspection Unicomp X Ray Aluminum Casting 160KV Fully Shield Cabinet

Fully Shield Cabinet X Ray NDT Inspection Equipment 160KV for Alumium Casting Flaw Inspection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm

Quality AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection factory

AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Quality Digital NDT Radiography Equipment Unicomp UNC160 X Ray Machine For Crack Porosity factory

Digital NDT Radiography Equipment Unicomp UNC160 X Ray Machine For Crack Porosity

Digital Radiography Unicomp UNC160 X ray machine for Electric insulator Non-destructive testing of crack porosity System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area