industrial x ray systems
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5 Um Micro Focus Unicomp X Ray Machine AX7900 For Semicon IC Components
5 m Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
PCBA Unicomp X Ray Machine AX7900 High Resolution FPD For BGA Die Bond Wire Inspection
PCBA X-Ray machine Unicomp AX7900 with high resolution FPD for BGA void IC die bond wire inspection Description of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
AX7900 Unicomp X Ray Machine 5 Micron Focus Spot Closed Tube For SMT BGA QFN IC Inspection
5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection Description of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
Real Time Industrial NDT X Ray Equipment For Brake Pads CE / FCC Certificated
CE/FCC Certificated Real Time Industrial NDT X Ray Equipment for Brake Pads Applications of NDT X-ray Machine UNC160: Cast parts and Pressure Vessels Steel pipe, Cylinder, and Wood Epoxy Resin Defect Detection Wheel, Tires, and Metal parts Technical Specifications of NDT X-ray Machine UNC160 System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work
AX7900 Unicomp X Ray Machine IC Chip Quality Check X Ray Inspection Equipment
IC Chip Quality Check with Unicomp AX7900 X Ray Inspection Equipment Description of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
2D Microfocus X Ray Machine For IC Semicon Lead Frame Inspection With CE FDA
2D microfocus X Ray machine for IC semicon Lead frame inspection with CE FDA compliance FEATURES of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm
Unicomp AX7900 X Ray Inspection Machine For Electric Switch Inner Quality Testing
Unicomp AX7900 X Ray Inspection Machine for Electric Switch Inner Quality Testing FEATURES of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm
AX7900 Real Time Digital X Ray Machine For Switch Inner Defects Inspection
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
5um High Resolution X Ray Equipment For Electric Switch Unicomp Factory Manufacturing
Unicomp Factory Manufacturing 5m High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5m/15m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm
