pcb inspection equipment
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SMT PCB Portable X-Ray Machine , Metal Detector X Ray Machine 0.5kW Power Consumption
Portable x-ray machine SMT PCB Metal X Ray Machine for Philippines Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360 rotary fixture (Optional) X-ray Leakage
Durable X Ray Metal Inspection System AX7900 For PCBA SMT LED Defects Detection
Metal Xray machine AX7900 for PCBA SMT LED defects detection Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5m/15m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage
Factory supply of DR RT NDT X-ray shield cabinet system for Casting parts crack porosity shrinkage detection
Factory supply of DR RT NDT X-ray shield cabinet system for Casting parts crack porosity shrinkage detection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm
High Precision PTH Through-Hole PCB Assembly X-ray AX7900 Unicomp High Stability
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
High Motion Precision 90kV Sealed Tube MOSFET Semiconductor Component X-ray Equipment AX7900 Unicomp Quality Control
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Electronics X-ray Inspection Machine AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder High Precision
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)1200(D)1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)1350(D)1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m Imaging
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD)
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector
