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Quality CSP X Ray Inspection Machine 90kV For Solar Cell Soldering factory

CSP X Ray Inspection Machine 90kV For Solar Cell Soldering

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Quality LCD Display 1.0kW X Ray Inspection Machine Unicomp AX8200 BGA Inspection factory

LCD Display 1.0kW X Ray Inspection Machine Unicomp AX8200 BGA Inspection

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Quality CSP Electronics X Ray Machine UNICOMP CX3000 For Cable Connector factory

CSP Electronics X Ray Machine UNICOMP CX3000 For Cable Connector

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high

Quality 1uSv/H Lithium Battery X Ray Inspection Equipment BGA CNC Mapping factory

1uSv/H Lithium Battery X Ray Inspection Equipment BGA CNC Mapping

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Quality Ductile Iron NDT X Ray Equipment Low Breakdown UNC450 For Aluminum Casting factory

Ductile Iron NDT X Ray Equipment Low Breakdown UNC450 For Aluminum Casting

UNC450 Ductile Iron NDT Real Time Imaging Unicomp X-ray Inspection Machine Features: High reliable and long life,low breakdown; High definition and resolution FPD; C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend); Multi-functional workstation,360rotation and shift; User friendly software design for easy interfacing can facilitate,customized software ; High penetration,Voltage up to 450KV,Maximum penetration thickness

Quality Unicomp AX8500 110kV 5um  2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check factory

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD)

Quality 5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void factory

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void

5m Microfocus X-ray with FPD 55 tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel

Quality 2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment factory

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector

Quality CSP LED 110kV X Ray Scanner 5um For LED Strip PCBA Soldering factory

CSP LED 110kV X Ray Scanner 5um For LED Strip PCBA Soldering

110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel Size