x ray detection equipment
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Agriculture Industrial X Ray Inspection Systems Vegetable Fruit Installed
Agriculture Industrial X Ray Inspection Systems Vegetable Fruit Installed in China Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. Full cycle support from products design to testing procedures and high-quality
Inline Wheel Hub Casting NDT X Ray Machine Inner Outer Structure Nonconformity Detection
Inline Wheel Hub X-ray Inspection inner outer structure nonconformity detection UNC160-Y2-D9 is our inline X-ray inspection system for alloy wheels. Using our new digital detector array it combines high-speed wheel inspection with outstanding image quality. Unicomp Technology UNC series offer dynamic lines of imaging systems and services for automotive components that detect defects. Safety-critical cast component manufacturers utilize x-ray inspection technology to verify
Inline NDT X Ray Equipment 2.8LP/Mm Detect Resolution Testing / Inspection Systems For Wheel Hub
Inline X-Ray Testing & Inspection Equipment & Systems for wheel hub Unicomp Technologies is a global supplier of innovative solutions for x-ray inspection and non-destructive testing (NDT). The unicomp systems are based on leading-edge x-ray and vision technology and ensure the fulfilment of customers' quality requirements. Unicomp Technologies product portfolio encompasses real-time failure analysis, including standardised systems for manual and automatic x-ray inspection,
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check
Unicomp X-ray insepction system for pack bulk can food foreign matter contamincation check APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
22" LCD Monitor SMT EMS Soldering Defects Electronic Inspection Equipment High Resolution
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55 and rotation 360operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Micro Focus Electronics X Ray System SMT Electronics Internal Defects Control
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
High Magnification Electronics X Ray System For BGA CSP/ QFN/PoP Void Inspection
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Multi - Function Electronics X Ray Machine High Speed Real Time For Gold Ball
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Ceramics, other special industries. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing
PCB BGA Inspection Electronics X Ray Machine Golf Ball Inside Quality Checking
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55 and rotation 360operation together with 6 axis movement Multi-function DXI image processing system, CNC programmable