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Unicomp industrial X-ray NDT inspection equipment for Automotive casting parts flaws detection
Unicomp industrial X-ray NDT inspection equipment for Automotive casting parts flaws detection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm
Factory supply of DR RT NDT X-ray shield cabinet system for Casting parts crack porosity shrinkage detection
Factory supply of DR RT NDT X-ray shield cabinet system for Casting parts crack porosity shrinkage detection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm
Airplane Engine Blade NDT Non Destructive Testing High Penetration UNC 450kV
High Penetration None-Destructive Testing (NDT) X-Ray Machine UNC450kV For Airplane Engine Blade Testing Features: High reliable and long life,low breakdown; High definition and resolution FPD; C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend); Multi-functional workstation,360rotation and shift; User friendly software design for easy interfacing can facilitate,customized software ; High penetration,Voltage up to 450KV
AC 110~220V Bga Inspection Equipment Hi Resolution FPD Detector For SMT Industrial
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area 570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
7-Axis manipulator with 55 degree tilting 130kV Xray machine Unicomp AX9100 for PCBA soldering Void cracks inspection
7-Axis manipulator with 55 degree tilting 130kV Xray machine Unicomp AX9100 for PCBA soldering Void cracks inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
Unicomp offline high penetration microfocus 130kV Xray machine AX9100 for SMT PCBA CPU IC soldering quality inspection
Unicomp offline high penetration microfocus 130kV Xray machine AX9100 for SMT PCBA CPU IC soldering quality inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
22" LCD Monitor SMT EMS Soldering Defects Electronic Inspection Equipment High Resolution
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7m closed X-ray tube, high speed & Millions pixels high resolution FPD Tilt detection with 55 and rotation 360operation together with 6 axis movement X-ray tube & detector automatic lifting and descending,
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
