x ray inspection system
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100KV Inline X Ray ADR Detection System BGA EMS For Inside Quality Inspection
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: Real-time image. 1000X system magnification. 100KV 5m X-Ray tube. Modular design with In-line expansibility. Economical and Practical. FPD Detector. 6 axis linkage system. X-ray tube and FPD simultaneously tilt 35. Applications: LED,SMT,BGA,CSP,Flip Chip Inspection. Semiconductor,Packaging components,Battery Industry. Electronic components, Auto parts, Photovolta
1.6kW Offline Programming Unicomp X Ray AX9100 For Connector
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Offline programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
3um Closed Tube 1.6kW X Ray Machine For SMT BGA CSP
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor,
FPD Detector Unicomp X Ray LED Bars Flaw 1000X System Magnification 5μm
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: 100KV 5m X-Ray tube. FPD Detector. Real-time image. 1000X system magnification. 6 axis linkage system. X-ray tube and FPD simultaneously tilt 35. Modular design with In-line expansibility. Economical and Practical. Applications: LED,SMT,BGA,CSP,Flip Chip Inspection. Semiconductor,Packaging components,Battery Industry. Electronic components, Auto parts, Photovolta
Microfocus Closed Tube Unicomp X Ray 130kV 3um For SMT BGA Soldering
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnificati
Real Time Unicomp X Ray 1.6kW AX9100 For Electronics Assembly
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
3µM Microfocus Tube X Ray Machine AX9100 for CSP EMS BGA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
130kV 3um Microfocus X Ray FPD Intensifier For Aluminum PCBA Soldering
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.
130kV Microfocus Unicomp X Ray AX9100 For SMT LED BGA QFN Voids Measurement
130kV Microfocus X Ray Inspection Machine Unicomp AX9100 For SMT LED BGA QFN Voids measurement Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die-casting, Moulding Plastic. Ceramics, Other Special Industries. Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition
