bga x ray inspection system
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High Magnifications PCB X-Ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Lithium Battery Inspection with Chinese Original Microfocus X-Ray Tube
Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply
High Magnifications PCB X-ray Machine Unicomp AX9100MAX For Electronics IC Components Bonding Wire Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Unicomp AX9100max X-ray Machine 130kV 65W for IGBT Inspection
Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
PCBA 22" LCD 1kW NDT Electronics X Ray Machine
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features Multi-function DXI image processing system, CNC programmable detection Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification 90kV 5m closed X-ray tube, digital flat panel with 2 mega pixels CCD camera Multi-function workstation with
X-ray System AX9100max With Algorithms For Image Super-Resolution Reconstruction
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
IC Curvature Measurement Unicomp AX9100MAX X-Ray Machine with 84μm Pixel Size and 60° Tilting Angle
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
Unicomp AX9100max X-ray Machine 2400kg for MOS Tube Inspection
Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
LED Strip Soldering Electronics X Ray System Void Flaw Detection CNC Control Mode
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
