bga x ray inspection system
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X-ray System AX9100max With Algorithms For Image Super-Resolution Reconstruction
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
IC Curvature Measurement Unicomp AX9100MAX X-Ray Machine with 84μm Pixel Size and 60° Tilting Angle
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)1760(D)1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
Unicomp AX9100max X-ray Machine 2400kg for MOS Tube Inspection
Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
LED Strip Soldering Electronics X Ray System Void Flaw Detection CNC Control Mode
LED Strip Soldering Quality / Void Flaw Detection X-Ray Machine Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
AX9100max Electronics X Ray Machine With Fixed-point Following During FPD Tilting
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)1680(D)1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)1950(D)1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Stand alone X Ray Detector Lithium Battery X Ray Machine with built in SPC
Stand alone Lithium Battery X-Ray Detector with built in SPC Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi
Unicomp AX9100max X-ray Machine For Cylindrical Cell
Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check
Unicomp 5um 90KV X Ray with FPD oblique view for Semicon IC wire bonding sweeping check Specifications of Xray machine: System Summary Footprint 1200(W)1200(D)1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)1350(D)1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85m
