industrial x ray systems
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Foreign Objects Detection Food X Ray Inspection System For Meat Vegetable Poultry Dumplings
Meat vegetable poultry dumplings Foreign Objects Detection X ray Inspection System Applications of UNX6030NUNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of UNX6030NEasy to Operate: one button start & stop, optional default productProvide High precision
UNX6030N Unicomp X Ray Machine Diode Array 0.4mm Resolution For Food Contamination Check
Unicomp Factory Supply X Ray Machine UNX6030N for Food contamination check Applications of Food Xray UNX6030N UNX6030-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray UNX6030N Easy to Operate: one button start & stop, optional default product Provide High
ADR ASTM Standard NDT X Ray Equipment Unicomp UNC225 For Weld Seams Quality Control
Welded Pipes X-Ray inspection machine Unicomp UNC225 for weld seams quality control with ADR and ASTM standard Non Destructive Testing (NDT) is an important part of industrial quality management. Much Digital Radiography (DR) standards like the EN-17636 or NADCAP demand high accuracy and reliable archiving of test results. Unicomp has years long experience with many different applications and industries. As requirements vary between industries and even companies all systems
Unicomp AX8200MAX 2.5D X Ray Machine Auto Measurement For PCBA BGA QFN
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD Display 3. Accurate
Real Time Unicomp X Ray Machine AX8200MAX 5 Micron Closed Tube For SMT EMS BGA Void Check
Real-time X-Ray machine Unicomp AX8200MAX with 5 micron closed tube for SMT EMS BGA void check Application Fields of BGA Xray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive Touch LCD
Unicomp UNX4015N X Ray Machine For Food Contamination Of Metal Stone Glass Ceramic Bone
Unicomp UNX4015N X-ray machine for food contamination of metal Stone Glass Ceramic bone Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Provide High precision automatic foreign
Unicomp UNX4015N Food X Ray Machine For Fresh Fish Confectionery Grain Product
Food contamination X-Ray machine of Unicomp UNX4015N for fresh meet fish confectionery grain product Application of UNX4015N UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of UNX4015N Easy to Operate: one button start&stop, optional default product Provide
Wire Harness Welding BGA X Ray Machine 2.5D Micro Focus Inspection AX8200MAX
Wire Harness Welding Quality Inspection by 2.5D micro focus X Ray Machine AX8200MAX Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24 FHD Interactive
Unicomp AX8200max X Ray Inspection Machine For Wire Harness Defects Inspection
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC
