pcb inspection system
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Unicomp industrial X-ray NDT inspection equipment for Automotive casting parts flaws detection
Unicomp industrial X-ray NDT inspection equipment for Automotive casting parts flaws detection System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range 500*800mm Load weight 50kg Work environment 5-40 80%HR Install power Three-phase five wire system AC380V X-ray leakage dose rate 1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm
EMS Semiconductor Unicomp X Ray Inspection Machine Electronics BGA AX8200
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Electronic Components BGA X Ray Inspection Machine
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,
Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time
BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300 X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power
Unicomp LX2000 CSP BGA X Ray Machine EMS Inline AXI Inspect Ceremic Air Hole
Using Unicomp LX2000 inline AXI X-ray to inspect ceremic air hole and cracks with Auto Inspection and Analysing Technical Parameters and Specifications System Summary Footprint 2595(W)1392(D)1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
AX7900 Unicomp X Ray Machine SMT PCB PCBA BGA Inspection High Resolutions
Unicomp AX7900 X-Ray machine with high resolutions FPD for SMT Printed circuit board PCBA BGA inspection Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
FPD 90KV X Ray Inspection System For PCBA Defect Detection Unicomp AX7900
FPD 90KV X Ray Inspection System for PCBA defect Detection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption
Advanced X-Ray Inspection Equipment for Electronics Industry 1000kg Maximum Load
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting 25 Safely Electromag
Industry Electronics Industry X-Ray Inspection Equipment for Wire 1280x1220x1615mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
