pcb inspection system
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AX9100 130kV Electronics X Ray Machine For Semiconductor Wire Bonding Sweep Inspection
High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
130kV X Ray Inspecting Machine AX9100 Tiltable HD Image Detector For EMS PCBA BGA
Tiltable HD Image Detector with 130kV X-ray inspecting machine AX9100 For EMS PCBA BGA and solder joints Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7m X-ray System Intensifier FPD Monitor 22 LCD System Magnification 1600 X Detection Region Max.Loading Size 570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7m X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7m X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
FPD Detector Bga X Ray Inspection System for Multi - Functional Workstation
BGA X Ray Inspection Machine high-quality PCB inspection system X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Installation Unicomp will provide installation and calibration service at the customers
AX9100 Unicomp 2.5D Pcb X Ray Machine 130KV Closed Tube For LED Void Inspection
AX9100 Unicomp 2.5D Pcb X Ray Machine 130KV Closed Tube For LED Void Inspection Unicomp AX9100 130KV Closed Tube 2.5D X-ray for LED PCBA soldering void quality inspection Pcb X Ray Machine Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt
Electronics Unicom X-Ray Machine For Defect Detection On Semiconductor Wafer Surfaces
EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is
Accurate X-Ray Inspection for PCB Control X-ray Leakage 1uSv/h Voltage 0-110kV Adjustable
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360 rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55
X-Ray Inspection Equipment for PCB with 1.0KW Power Consumption 1280 L x1220 W x1615 H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
