x ray detection systems
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10 KW NDT X Ray Equipment For Casting Defects Heat Sinks / Hot Tears / Cold Flow
Casting defects heat sinks, hot tears, cold-flow, drag-marks, missing material and cracks NDT X-Ray Inspection Application Fields of X Ray Machine UNZ-450 Engineering components Small aluminum castings, iron castings Auto parts, metal products Technical Parameters and Specifications of X Ray Machine UNZ-450 System Parameters Dimensions 2766mm*2813mm*2598mm(L*W*H) Equipment weight 17.5T Power 10 kW Maximum penetration (FE) 80 mm Detection range 550*200mm Load weight
CE/FDA Certificated FPD 90KV X-ray Inspection System for Capacitor Defects Detecting
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
AX7900 IC LED Clips X-ray Inspection Machine , Digital Electronics X Ray Machine
AX7900 IC LED Clips X-ray Inspection Machine Electronic Components Detector Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm x 420mm , max.
Low Breakdown 225KV NDT X Ray Machine Automotive Aircraft Vessel Inspection
Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225 Features: High reliable and long life,low breakdown High definition and resolution FPD C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) Multi-functional workstation,360rotation and shift User friendly software design for easy interfacing can facilitate,customized software High penetration,Voltage up to 225KV,Maximum penetration thickness up
Electronic Components BGA X Ray Inspection Machine
Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,
BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage
SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage
Industrial X Ray Imaging System 80kV / 90kV Source With Submicron Focal Spot Size
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size FEATURES: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. 60 "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, 60 tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x 380mm,
In-line Cylindrical Lithium Battery X Ray Machine with Safety oriented design
In-line Cylindrical Lithium Battery X-ray Detector with Safety-oriented design The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in various types
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection
130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor, Packaging components, Battery
