x ray inspection system
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Offline AX8200Max SMT EMS X Ray Machine Auto Mapping measurement
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)1500(D)1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)155(D)200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
SMT PCB X-Ray Machine High Resolution Micron Focus Spot Size Unicomp AX7900 For Cellphone Inside Quality And Cracks Inspection
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
Unicomp AX7900 High Specifications 2D 2.5D X-Ray Machine for Cellphone Inspection and Cracks Checking
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
SMT EMS Detection Unicomp X Ray Machine PCBA BGA Inspection Linear Array Detector
High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0 40 / 30 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 A Focal Spot Size: 5 micron
100kV 1uSv/h X Ray Detection Machine 1.0KW For LED Soldering
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
LED Soldering 1kW 90KV X Ray Detection Equipment 24''
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
1kW 1uSv/H 90KV X Ray Scanning Machine For LED Lighting
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
Closed Tube Electronics X Ray Machine AX8200B 100kv For Alignment Inspection
Digital Real Time AX8200B X Ray Machine for diamond core drill bit inner layer alignment inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
AX8200B Unicomp X Ray Machine CNC Programmable Inspection For Cylindrical Lithium Battery
AX8200B X-Ray machine for cylindrical lithium battery CNC programmable inspection with auto measurement Features: 100KV 5m X-ray tube, image intensifier with 2 mega pixels CCD camera. Motion controls include: 60 tilt motion, X/Y table motion plus Z axis tube and detector movement. Multi-function DXI image processing system X/Y programming function for multiple image inspection routines Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X
