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Quality AX7900 25 Degree Tilting Electronics X Ray Machine For BGA CSP Flip Chip Inspection factory

AX7900 25 Degree Tilting Electronics X Ray Machine For BGA CSP Flip Chip Inspection

AX7900 with function of tilting 25 for better inspection effect Description of IC X Ray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm

Quality 90kV Off-Line PCB X-Ray Machine Unicomp AX7900 For IC & BGA Soldering Balls factory

90kV Off-Line PCB X-Ray Machine Unicomp AX7900 For IC & BGA Soldering Balls

5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection Description of IC Xray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection

Quality 80KV/90KV Electronics X Ray Machine Precise Location Laser Locator For Chip Inner Defects Inspection factory

80KV/90KV Electronics X Ray Machine Precise Location Laser Locator For Chip Inner Defects Inspection

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Quality 5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void factory

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void

5m Microfocus X-ray with FPD 55 tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector (FPD) Pixel

Quality 1.6kW Offline Programming Unicomp X Ray AX9100 For Connector factory

1.6kW Offline Programming Unicomp X Ray AX9100 For Connector

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Offline programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. Applications: SMT, BGA, CSP, Flip Chip, LED Detection.

Quality 3um Closed Tube 1.6kW X Ray Machine For SMT BGA CSP factory

3um Closed Tube 1.6kW X Ray Machine For SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: 90-130KV 7m X-Ray tube. High speed & Millions pixels high resolution FPD. 1000X magnification, high-definition real-time image. One-button operation with 2.5D image display. Off-line programming function, navigation mode detection. 7 axis linkage, 70 degree tilt detection. SMT, BGA, CSP, Flip Chip, LED Detection. Semiconductor,

Quality BGA QFN CSP X Ray Equipment LX2000 CNC Programmable For FPC SMT Soldering factory

BGA QFN CSP X Ray Equipment LX2000 CNC Programmable For FPC SMT Soldering

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)1392(D)1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)170(D)190(H)cm (X-Ray) 150(W)105(D)120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

Quality CSP LED X Ray Machine Closed Tube Flip Chip AX8500 For 100KV Semiconductor factory

CSP LED X Ray Machine Closed Tube Flip Chip AX8500 For 100KV Semiconductor

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)1300(D)1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)1500(D)2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5m Imaging System Detector Flat Panel Detector

Quality CX3000 Electronics PCBA Unicomp X Ray Detection Machine , Benchtop X Ray Machine factory

CX3000 Electronics PCBA Unicomp X Ray Detection Machine , Benchtop X Ray Machine

CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5m 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 10001124; 3. Equipped with 360 rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto