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x ray inspection equipment

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Quality BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage factory

BGA X Ray Inspection System , X Ray Pcb Inspection Machine Higher Test Coverage

SMT , BGA , CSP , Flip Chip , LED BGA X Ray Inspection Machine Unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage

Quality IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization factory

IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization

IHDR Algorithm Enhanced BGA & PCBA X-ray Inspection UNICOMP AX8300 Ultra-Clear Defect Visualization The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect In Between design that offers a solution when 90kV is not enough energy and 130kV is too much.Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can

Quality Electronic Components BGA X Ray Inspection Machine factory

Electronic Components BGA X Ray Inspection Machine

Online inspection system for Checking LED Semiconductor Electronic Components The X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids,

Quality Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time factory

Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time

BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300 X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power

Quality High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type factory

High Performance Electronics X Ray Machine , BGA Inspection Equipment Closed Tube Type

Electronic and electrical components BGA X Ray Inspection Machine Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60 X-Ray System Tube Type Closed Voltage/Current 100kv/200A Focal Spot Size 5m FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x

Quality High Efficient BGA X Ray Inspection Machine , Micro Focus X Ray Cabinet Systems factory

High Efficient BGA X Ray Inspection Machine , Micro Focus X Ray Cabinet Systems

Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200A Spot Size 5m Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360 rotary fixture (Optional) X-ray Leakage

Quality High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 factory

High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300

High-Precision 2.5D/3D X-ray Inspection for BGA & PCBA Defect Detection UNICOMP AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect In Between design that offers a solution when 90kV is not enough energy and 130kV is too much.Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme

Quality Unicomp factory supply of  90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection factory

Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection

Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Quality Unicomp AX7900  90kV X ray inspection machine for SMT BGA soldering void  IC quality inspection factory

Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection

Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5m X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with 60 tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area